JPH0431040B2 - - Google Patents

Info

Publication number
JPH0431040B2
JPH0431040B2 JP33043287A JP33043287A JPH0431040B2 JP H0431040 B2 JPH0431040 B2 JP H0431040B2 JP 33043287 A JP33043287 A JP 33043287A JP 33043287 A JP33043287 A JP 33043287A JP H0431040 B2 JPH0431040 B2 JP H0431040B2
Authority
JP
Japan
Prior art keywords
plating
tank
plating tank
plated
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP33043287A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01172598A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP62330432A priority Critical patent/JPH01172598A/ja
Publication of JPH01172598A publication Critical patent/JPH01172598A/ja
Publication of JPH0431040B2 publication Critical patent/JPH0431040B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP62330432A 1987-12-25 1987-12-25 全面メッキ装置 Granted JPH01172598A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62330432A JPH01172598A (ja) 1987-12-25 1987-12-25 全面メッキ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62330432A JPH01172598A (ja) 1987-12-25 1987-12-25 全面メッキ装置

Publications (2)

Publication Number Publication Date
JPH01172598A JPH01172598A (ja) 1989-07-07
JPH0431040B2 true JPH0431040B2 (en]) 1992-05-25

Family

ID=18232550

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62330432A Granted JPH01172598A (ja) 1987-12-25 1987-12-25 全面メッキ装置

Country Status (1)

Country Link
JP (1) JPH01172598A (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4684841B2 (ja) * 2005-10-14 2011-05-18 株式会社太洋工作所 表面処理装置及び表面処理方法

Also Published As

Publication number Publication date
JPH01172598A (ja) 1989-07-07

Similar Documents

Publication Publication Date Title
US4401522A (en) Plating method and apparatus
US6309517B1 (en) Apparatus for inline plating
US6322686B1 (en) Tin electrolyte
NL8203845A (nl) Elektrobekledinginrichting en werkwijze voor elektrobekleding.
US4377461A (en) Tab plater for circuit boards or the like
KR101074314B1 (ko) 적어도 표면에서는 전도성을 띠는 작업물을 전해 처리하는장치 및 방법
JP6737527B2 (ja) 表面処理装置
US4948486A (en) Electroplating apparatus for plate-shaped workpieces, particularly printed circuit boards
JPH0431040B2 (en])
JPH0413439B2 (en])
JPH0314911B2 (en])
CN214544956U (zh) 具有连续制程的舱体系统
JPH0433880B2 (en])
CA1190514A (en) High speed plating of flat planar workpieces
USRE28174E (en) Apparatus for liquid treatment of flat materials
JPH0224396B2 (en])
US4394241A (en) High speed plating of flat planar workpieces
TWM575811U (zh) 電鍍機器
US4378282A (en) High speed plating of flat planar workpieces
TWI677599B (zh) 電鍍裝置
KR930006496B1 (ko) 콘베어형 유산동 도금장치
JP6793063B2 (ja) 部分めっき装置、部分めっき方法、および部分めっき部材の製造方法
JPS58128792A (ja) プリント基板の一次銅メツキ方法及び装置
JPH03277796A (ja) 短尺板状被メッキ物への全面メッキ方法、装置および保持治具
KR20020064483A (ko) 롤러구동형 음극을 이용한 수평식 도금장치 불용성양극판과 분무박스를 이용한 수직.수평식 도금장치